Soft thixotropic, solvent free, epoxy paste, formulated to cure at room temperature and produce a high strength structural adhesive for bonding of metals, particularly aluminium and steel.
Formulated to overcome the problem of peeling failure in a metal-resin interface.
High chemical resistance, high compressive and tensile strengths and also has excellent adhesion to all normal substrates.
Mix ratio resin 1 part to hardener 1 part.
Soft thixotropic, solvent free, epoxy paste, formulated to cure at room temperature and produce a high strength structural adhesive for bonding of metals, particularly aluminium and steel.
Formulated to overcome the problem of peeling failure in a metal-resin interface.
High chemical resistance, high compressive and tensile strengths and also has excellent adhesion to all normal substrates.
Mix ratio resin 1 part to hardener 1 part.
